![]() ![]() Original Assignee Sumitomo Chemical Co Ltd Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor Yasuhisa Saito Katsuya Watanabe Kohichi Okuno Kunimasa Kamio Akira Morii Hiroshi Nakamura Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Granted Application number EP19860307453 Other languages German ( de) Google Patents Low-viscosity epoxy resin, resin composition containing it, and fibre-reinforced composite material containing cured product of the compositionĭownload PDF Info Publication number EP0217657A2 EP0217657A2 EP19860307453 EP86307453A EP0217657A2 EP 0217657 A2 EP0217657 A2 EP 0217657A2 EP 19860307453 EP19860307453 EP 19860307453 EP 86307453 A EP86307453 A EP 86307453A EP 0217657 A2 EP0217657 A2 EP 0217657A2 Authority EP European Patent Office Prior art keywords epoxy resin viscosity composite material resin composition fibre Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents EP0217657A2 - Low-viscosity epoxy resin, resin composition containing it, and fibre-reinforced composite material containing cured product of the composition Limited flow and low exotherm when curing.EP0217657A2 - Low-viscosity epoxy resin, resin composition containing it, and fibre-reinforced composite material containing cured product of the composition Post curing at 400☏ for 1-2 hours to optimize properties. Flowable, high viscosity system, cures in 4-6 hours at 300☏ or 2-3 hours at 350☏. One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Stellar electrical insulation properties. Toughened epoxy system for bonding, sealing and specialty dam-and-fill encapsulation. Successfully tested at 1,000 hours 85☌/85% RH. Cures in 60-75 minutes at 250☏, shorter times at higher temperatures. Tensile lap shear strength 2,800-3,000 psi. Resistant to thermal cycling, mechanical vibration/shock. Single component toughened epoxy adhesive with good flow properties. Ideal for bonding similar and dissimilar substrates. Potting, encapsulation, coating, sealing, impregnation compound. Meets NASA low outgassing specifications. Low viscosity, optically clear epoxy with superior electrical insulation properties. Products such as EP21TDCHT-LO and Supreme 10HTCL have a moderately flowable viscosity, whereas Supreme 10HTND-3, Supreme 3HTND-2DM-1, and EP17HTDM-2 Black offer a non-drip paste consistency, for applications where no flow is desired.įind out more about our adhesives with different viscosities. ![]() ![]() Some examples are our products EP30LV-1, EP62-1LPSP, and Supreme 112, which have extremely low viscosities and excellent wicking capabilities, for filling tiny gaps. Master Bond epoxy compounds are available in a very wide range of viscosities from as low as 100 cps to in excess of 1,500,000 cps for various bonding, coating, sealing and potting applications. Most of the epoxy resin compounds, like the great majority of other polymer systems, fall into the Non-Newtonian category.Īn epoxy’s viscosity defines the applications (such as bonding, sealing, potting etc.) that it can be used for, as well as the means by which it can be applied. In Newtonian fluids, the viscosity doesn’t depend on the shear rate, whereas in Non-Newtonian fluids, the viscosity changes based on the shear rate. Fluids are broadly classified as: Newtonian Fluids and Non-Newtonian fluids. Viscosity may be simply defined as the resistance to flow, of a liquid. High viscosity pastes are noted for their non-drip or non-sagging properties, and are used in applications where the epoxy needs to stay in its place while applying and curing. Moderate viscosity products offer convenient dispensing, and are widely used in many bonding and sealing applications. Low viscosity systems excel in many kinds of applications, including potting, encapsulation, and impregnation. Master Bond epoxy adhesives are formulated in low, medium, and high / non-drip viscosities. Viscosity is a key criterion in the epoxy selection process, for many bonding, sealing, coating, and potting applications. ![]()
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